High accuracy and quality of surface finish for special applicationsID sawing
For high standards of precision, surface finish and plane parallelism when cutting and sawing hard, brittle materials, annular or inner-diameter (ID) cutting or sawing is ideally suited. With this specialised method, particularly narrow cutting widths can be obtained with very slim kerf, as are required for the manufacturing of silicon or germanium wafers and in optical applications. At the same time, ID sawing permits a high degree of material efficiency, as the material loss during sawing is very low compared with other methods.
ID sawing is a cutting process in which the material is cut through slowly and gently by the inner edge of a rotating saw blade with a circular cut-out. In contrast to alternative cutting methods, such as diamond-wire sawing, the surface of the workpiece is already very even after the cutting process. This minimises the time required for further treatment, especially surface grinding.
Facts
Very high accuracy (high plane parallelism, narrow cutting widths)
Low loss of material
Technical data
Workpiece dimensions
Circular: (Ø) >200 mm
Rectangular: max. 320×100 mm
Thickness: 0.1±0.05 mm – 60.0±0.05 mm
Accuracy
Plane parallelism: <0.05 mm
Average roughness (Ra): <0.5 µm
Roughness depth (Rz): <4 µm
Capacity
Batch sizes: One-off to series cuts
